We have state of the art infrastructure, with the latest equipment for the SMT Technology, so as to cater different segment of products. Through our state of the art production equipment we can assemble extremely dense and miniature as well as mixed technologies with a installed capacity of more than 600000+ CPH. We currently build assemblies with 0201 packages, BGA's, uBGA's, Double Side SMT with glue dispensing and can handle various IC packages such as QFP, QFN, DFN, TSSOP, MSOP, TQFP, Package on Package, PBGA's, etc.

Also the setup can handle PCB from 50mmx50mm size to 1300mm long PCB. Machines are well equipped to handle double side PCB to multi layer PCBs.

Some of the Key installed equipments,