We have a state-of-the-art manufacturing infrastructure equipped with the latest SMT technology to cater to a wide range of product segments. Our advanced production facilities enable us to assemble highly dense, miniature, and mixed-technology PCB assemblies with an installed capacity exceeding 750,000 components per hour (CPH).

We currently manufacture assemblies using 0201 packages, BGAs, uBGAs, and double-sided SMT with glue dispensing, and can efficiently handle a variety of IC package types, including QFP, QFN, DFN, TSSOP, MSOP, TQFP, Package-on-Package (PoP), PBGAs, and more.

Our manufacturing setup supports PCB sizes ranging from 50 mm × 50 mm up to 1300 mm in length. The equipment is fully capable of processing double-sided as well as multilayer PCBs, ensuring flexibility and precision for diverse application requirements.

Some of the Key installed equipments,